半導體製造概論
Introduction to Semiconductor Manufacturing

English ｜ 繁體中文 ｜ 简体中文 ｜ 日本語 ｜ 한국어

An open, beginner-friendly book that follows one silicon wafer from sand, through the fab, test and packaging, until it becomes a chip. It skips heavy physics and focuses on process flow, terminology and know-how from the fab floor, with term boxes and know-how boxes in every chapter. No background in semiconductor physics is needed.

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Contents · 目錄 · 目次 · 목차

Part 0: Before You Start · 第 0 部 開始之前 · 第 0 部 はじめる前に · 제0부 시작하기 전에

章	English	繁體中文	简体中文	日本語	한국어
0	The Big Picture	半導體製造全景	半导体制造全景	半導体製造の全体像	반도체 제조의 전체 그림
1	How a Fab Works	晶圓廠如何運作	晶圆厂如何运行	ファブの仕組み	팹은 어떻게 돌아가는가

Part 1: Fundamentals · 第 1 部 基礎 · 第 1 部 基礎 · 제1부 기초

章	English	繁體中文	简体中文	日本語	한국어
2	From Physics to Transistors	從物理到電晶體	从物理到晶体管	物理からトランジスタへ	물리에서 트랜지스터까지
3	From Sand to Wafer	從沙子到晶圓	从沙子到晶圆	砂からウェーハへ	모래에서 웨이퍼까지

Part 2: Process Modules · 第 2 部 製程模組 · 第 2 部 プロセスモジュール · 제2부 공정 모듈

章	English	繁體中文	简体中文	日本語	한국어
4	Lithography	微影	光刻	リソグラフィ	리소그래피
5	Thin Films	薄膜	薄膜	薄膜	박막
6	Etching	蝕刻	刻蚀	エッチング	식각
7	Ion Implantation and Thermal Processing	離子佈植與熱處理	离子注入与热处理	イオン注入と熱処理	이온 주입과 열처리
8	CMP	CMP	CMP	CMP	CMP
9	Cleaning and Contamination Control	清洗與污染控制	清洗与污染控制	洗浄と汚染管理	세정과 오염 관리
10	Metallization	金屬化	金属化	メタライゼーション	금속 배선

Part 3: Process Integration · 第 3 部 製程整合 · 第 3 部 プロセスインテグレーション · 제3부 공정 통합

章	English	繁體中文	简体中文	日本語	한국어
11	A Complete CMOS Process Flow	走一遍完整的 CMOS 流程	走一遍完整的 CMOS 流程	CMOS プロセスフローを一通り	CMOS 공정 흐름 한눈에 보기
12	Advanced Transistor Structures	先進電晶體結構	先进晶体管结构	先端トランジスタ構造	첨단 트랜지스터 구조
13	Memory Processes	記憶體製程	存储器工艺	メモリのプロセス	메모리 공정
14	What Does "3 nm" Really Mean?	「幾奈米」是什麼意思	「几纳米」是什么意思	「何ナノ」とは何か	'몇 나노'란 무엇인가

Part 4: Quality and Yield · 第 4 部 品質與良率 · 第 4 部 品質と歩留まり · 제4부 품질과 수율

章	English	繁體中文	简体中文	日本語	한국어
15	Metrology and Inspection	量測與檢測	测量与检测	計測と検査	계측과 검사
16	Yield and Failure Analysis	良率與故障分析	良率与失效分析	歩留まりと故障解析	수율과 불량 분석
17	Process Control	製程控制	工艺控制	プロセス制御	공정 제어
18	Handling Abnormalities and Engineering Changes	異常處理與工程變更	异常处理与工程变更	異常処置と変更管理	이상 처리와 엔지니어링 변경

Part 5: Back End — Test and Packaging · 第 5 部 後段：測試與封裝 · 第 5 部 後工程：テストとパッケージング · 제5부 후공정: 테스트와 패키징

章	English	繁體中文	简体中文	日本語	한국어
19	Wafer Test	晶圓測試	晶圆测试	ウェーハテスト	웨이퍼 테스트
20	Packaging	封裝	封装	パッケージング	패키징
21	Advanced Packaging	先進封裝	先进封装	先端パッケージング	첨단 패키징
22	Final Test and Reliability	最終測試與可靠度	最终测试与可靠性	最終テストと信頼性	최종 테스트와 신뢰성

Part 6: Beyond the Fab · 第 6 部 走出晶圓廠 · 第 6 部 ファブの外へ · 제6부 팹 밖으로

章	English	繁體中文	简体中文	日本語	한국어
23	How Systems Run the Fab	工廠如何被系統管理	工厂如何被系统管理	システムによるファブ運営	시스템이 팹을 운영하는 방법
24	How the Process Shapes Firmware	製程如何影響韌體	工艺如何影响固件	プロセスとファームウェア	공정이 펌웨어에 미치는 영향

Appendices · 附錄 · 付録 · 부록

	English	繁體中文	简体中文	日本語	한국어
A	Glossary	術語總表	术语总表	用語集	용어집
B	Fab Jargon	現場行話	现场行话	現場用語	현장 용어
C	Further Reading	延伸閱讀	延伸阅读	参考文献	참고 자료

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Reading paths

Path	Chapters
🚀 Quick overview	0, 1, 11, 14
💻 Software and firmware engineers	0, 2, 11, 13, 14, 22, 23, 24
🏭 Joining the industry	The whole book, especially 1, 11, 15–18 and Appendix B
📦 Packaging and test	0, 11, 19–22

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Contributing

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The original text is written in Traditional Chinese, and the other languages are translations of it. If this book helps you, please give it a ⭐ star so that more people can find it.

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Disclaimer

This book is based on public information and general industry knowledge. It contains no confidential information, process parameters or internal procedures of any company, and it is not affiliated with any semiconductor company. Most numbers are orders of magnitude or approximate values; actual values vary by process, product and company.

License

The text and images are licensed under CC BY-NC-SA 4.0. You may share, adapt and translate them for non-commercial purposes, as long as you give credit and share your work under the same license.